MEMS Oscillators |
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MEMSpeed Pro II, Low Power MEMS Oscillator Programming Kits Programmable frequency range; 1.0000 to 150.000MHz • The MEMSpeed Pro II kit includes a programming dongle, USB cable, antistatic tweezers and USB flash drive with a Windows based PC installation program. The MEMSpeed Pro II is used with device dependent socket adapter cards and the appropriate package devices. MEMS oscillator socket adaptor kit is required. |
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ASDM 2.5 x 2.0 x 0.8mm Available Now. In Stock!!
1.8Vdc to 3.3Vdc • Plastic QFN Package • CMOS output up to 150MHz
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ASDMB 2.5 x 2.0 x 0.8mm NEW 2011! Industrial Grade! 1.8Vdc to 3.3Vdc • Plastic QFN Package • CMOS output up to 150MHz
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ASEM 3.2 x 2.5 x 0.85mm Available Now. In Stock!!
1.8Vdc to 3.3Vdc • Plastic QFN Package • CMOS output up to 150MHz
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ASEMB 3.2 x 2.5 x 0.85mm NEW 2011! Industrial Grade!
1.8Vdc to 3.3Vdc • Plastic QFN Package • CMOS output up to 150MHz
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ASEMP 3.2 x 2.5 x 0.85mm NEW 2011! Industrial Grade High Performance MEMS Oscillator!
Low power, and low jitter for high speed data communication • 2.25Vdc to 3.6Vdc • Plastic QFN Package • CMOS, LVPECL, LVDS, and HCSL output 10 MHz to 425MHz
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ASEMCC 3.2 x 2.5 x 0.85mm NEW 2011! Industrial Grade 3G MEMS Oscillator!
Pin Configurable-CMOS output, Low power, and low jitter for high speed data communication • 2.25Vdc to 3.6Vdc • Plastic QFN Package • 10 MHz to 170MHz for CMOS
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ASEMDC 3.2 x 2.5 x 0.85mm NEW 2011! Industrial Grade 3G MEMS Oscillator!
Pin Configurable Dual CMOS output, Low power, and low jitter for high speed data communication • 2.25Vdc to 3.6Vdc • Plastic QFN Package • 10 MHz to 170MHz for CMOS
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ASEMDHC 3.2 x 2.5 x 0.85mm NEW 2011! Industrial Grade 3G MEMS Oscillator!
Pin Configurable dual HCSL output, Low power, and low jitter for high speed data communication • 2.25Vdc to 3.6Vdc • Plastic QFN Package • 10 MHz to 460MHz for HCSL
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ASEMDLC 3.2 x 2.5 x 0.85mm NEW 2011! Industrial Grade 3G MEMS Oscillator!
Pin Configurable LVDS-CMOS dual output, Low power, and low jitter for high speed data communication • 2.25Vdc to 3.6Vdc • Plastic QFN Package • 10 MHz to 460MHz for CMOS, 10 MHz to 460MHz for LVDS
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ASEMDLP 3.2 x 2.5 x 0.85mm NEW 2011! Industrial Grade 3G MEMS Oscillator!
Pin Configurable LVPECL CMOS Dual output, Low power, and low jitter for high speed data communication • 2.25Vdc to 3.6Vdc • Plastic QFN Package • 10 MHz to 460MHz
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ASEMDLV 3.2 x 2.5 x 0.85mm NEW 2011! Industrial Grade 3G MEMS Oscillator!
Pin Configurable LVDS-CMOS dual output, Low power, and low jitter for high speed data communication • 2.25Vdc to 3.6Vdc • Plastic QFN Package • 10 MHz to 460MHz
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ASFLM 5.0 x 3.2 x 0.85mm Available Now. In Stock!!
1.8Vdc to 3.3Vdc • Plastic QFN Package • CMOS output up to 150MHz
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ASFLMB 5.0 x 3.2 x 0.85mm NEW 2011! Industrial Grade! 1.8Vdc to 3.3Vdc • Plastic QFN Package • CMOS output up to 150MHz
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ASFLMP 5.0 x 3.2 x 0.85mm NEW 2011! Industrial Grade High Performance MEMS Oscillator!
Low power, and low jitter for high speed data communication • 2.25Vdc to 3.6Vdc • Plastic QFN Package • CMOS, LVPECL, LVDS, and HCSL output 10 MHz to 425MHz
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ASVM 7.0 x 5.0 x 0.85mm Available Now. In Stock!!
1.8Vdc to 3.3Vdc • Plastic QFN Package • CMOS output up to 150MHz
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ASVMB 7.0 x 5.0 x 0.85mm NEW 2011! Industrial Grade!
1.8Vdc to 3.3Vdc • Plastic QFN Package • CMOS output up to 150MHz
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150MHz |
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ASVMP 7.0 x 5.0 x 0.85mm NEW 2011! Industrial Grade High Performance MEMS Oscillator!
Low power, and low jitter for high speed data communication • 2.25Vdc to 3.6Vdc • Plastic QFN Package • CMOS, LVPECL, LVDS, and HCSL output 10 MHz to 425MHz
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SHOCK RESISTANCE |
One of the areas in which micromechanical resonator oscillators perform better over quartz crystal is the shock resistance. MEMS resonator typically has mass as small as 10-14kg and its stiffness is usually as high as tens thousand of N for high frequency structures. Simulations show being able to achieve up to 100,000g shock. The resonator itself will survive the g-shock very well.
However, the impact of the g-shock for the packaging could be severe since the packaging contains most of the mass. In this particular evaluation, we flip-chip resonator on top of an oscillator ASIC with solder balls as show below in Figure 1, which probably represent a worse case package compared to ceramic package or plastic over-mold package.
If the oscillator experience 30,000g shock along x, y, and z-axis, the z-axis stress and two shear stresses are listed in Table 1. Therefore, this type of oscillator will survive 30,000g of shock. A recent test has shown that MEMS oscillators can survived the g-shock of an air gun. All of the tested 125MHz MEMS oscillator tested, did not show any performance degradation.
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Table 1:
Stress generated due to 30,000g shock in a BGA assembled MEMS oscillator.
Click on image to enlarge.
Learn more about this study in our whitepapers, click here for white paper. |
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VIBRATION OPERATION |
Silicon MEMS oscillators were tested under random vibration ranging from 2.84G to 50G. The output spectral out of the oven for a thermal cycle test, as shown below, the frequency deviation across the temperature did not change with time.
Based on results of a previous test, we know that the packaged resonator passed the Height Temperature Storage Life (HTSL), this data indicates that the resonator/oscillator package did not degrade with high temperature storage.
With all the reliability data shown in previous sections, and with the fact these oscillators have met the XO specification including jitter, power consumption, voltage variation, and temperature stability, MEMS-based silicon resonator oscillators are now ready for commercialized shipping in timing and frequency reference applications.
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Vibration Operation:
High temperature storage life + thermal cycling. Click on image to enlarge.
Learn more about this study in our whitepapers, click here for white paper.
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Shock and Vibration Information Courtesy of Discera |